130306E38 | Bungard
PCB with positive photo resist, 150 x 200 mm, single-sided, FR2 1.5 mm, µm Cu, Bungard 130306E38
PCBs with positive photo resist on phenolic resin laminated paper substrate, type Bungard 130306.
Substrate: laminated paper FR 2. Board thickness: 1.5 mm, single- or double-sided 35 µm copper plating, 0.5 µm photo resist layer. Tested or approved to UL, NEMA, MIL, DIN, IEC.
Technical attributes (type, format, version copper plating): 130306E38, 150 x 200, single-sided
Version | circuit board | |
Width | 200 mm | |
One / two-sided | single sided | |
Height | 1.5 mm | |
copper strength | 35 m | |
Length | 150 mm | |
Material | FR2 hard paper |
Country of origin | DE |
Customs tariff number | 37019900 |
RoHS conform | Yes |
Date of RoHS guidelines | 3/31/15 |
SVHC free | Yes |