Cage Assembly, 2170088-1, TE Connectivity
Form Factor: zSFP+, Pluggable I/O Product Type: Connector, Connector System: Cable-to-Board, Sealable: No, Connector & Contact Terminates To: Printed Circuit Board, Number of Positions: 20, Data Rate (Max): 32 Gb/s, Contact Mating Area Plating Material: Gold or Gold Flash over Palladium Nickel, Contact Current Rating (Max): 0.5 A, Termination Method to Printed Circuit Board: Surface Mount, PCB Mounting Style: Surface Mount, Connector Mounting Type: Board Mount, Centerline (Pitch): 0.8 mm, Operating Temperature Range: -55 – 85 °C, For Use With Pluggable I/O Products: zSFP+ SMT Connector, Pluggable I/O Applications: SFP+, Circuit Application: Power & Signal, UL Flammability Rating: UL 94V-0, Packaging Method: Reel
