SO DIMM Sockets, 2013289-2, TE Connectivity
DRAM Type: Double Data Rate (DDR) 3, Connector System: Cable-to-Board, Sealable: No, Connector & Contact Terminates To: Printed Circuit Board, Product Type: Socket, Center Key: Offset Left, Module Orientation: Right Angle, Number of Positions: 204, Number of Rows: 2, Keying: Standard, DRAM Voltage: 1.5 V, SGRAM Voltage: 1.5 V, Ejector Type: Locking, Connector Profile: Standard, Contact Base Material: Copper Alloy, Contact Mating Area Plating Material: Gold, Contact Mating Area Plating Material Thickness: 0.254 µm, Contact Current Rating (Max): 0.5 A, Socket Type: Memory Card, Insertion Style: Cam-In, PCB Mount Retention Type: Solder Peg, PCB Mounting Style: Surface Mount, Connector Mounting Type: Board Mount, Centerline (Pitch): 0.6 mm, Housing Color: Black, Stack Height: 5.2 mm, Row-to-Row Spacing: 8.2 mm, Operating Temperature Range: -55 – 85 °C, Circuit Application: Power, UL Flammability Rating: UL 94V-0, Packaging Method: Semi-Hard Tray Assembly, Packaging Quantity: 20, Comment: With floating peg.
