RE944-S3 | Roth Elektronik
Development board, 46.99 x 73.02 mm, pitch 2.54 mm, double-sided, FR4 epoxy, Cu 35 µm, RE944-S3
Order No.: 10H6248
EAN: 4099889462067
MPN:
RE944-S3
Breadboard, RE944-S3, Roth Elektronik
Breadboards with 2.54 mm grid; Substrate: epoxy fiber-glass FR 4, single-sided (35 µm Cu), hot-tinned, with solder resist. Board thickness: 1.5 mm.
For 28-pin sockets, type RE944-S3.
Each side 14 3-hole and 2 x 14 2-hole solder pads, with U-shaped ground potential trace, breadboard field with 2.54 mm grid, 12 x 16 solder pads Ø 2.20 mm; Dimensions: 46.99 x 73.02 mm.
Type: RE944-S3, breadboard.
Technical specifications
| Filter | Property | Value |
|---|---|---|
| Version | experimentation board | |
| One / two-sided | double-sided | |
| Material | FR4 epoxy | |
| Throughplated | Yes | |
| Grid | 2.54 mm | |
| Length | 46.99 mm | |
| Width | 73.02 mm | |
| Height | 1.5 mm | |
| Hole diameter | 1.1 mm | |
| copper strength | 35 m | |
| Surface type | hot air leveling (HAL) |
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Logistics
| Property | Value |
|---|---|
| Country of origin | CN |
| Customs tariff number | 85340019 |
Compliance
| Property | Value |
|---|---|
| RoHS conform | Yes |
| Date of RoHS guidelines | 3/31/15 |
| SVHC free | Yes |