RE60-LF | Roth Elektronik
Lab board, 100 x 160 mm, pitch 2.54 mm, single sided, FR4 epoxy, Cu 35 µm, RE60-LF
Prototyping board, RE60-LF, Roth Elektronik
Single-sided 35 µm copper plating.
Dimensions: 100 x 160 mm.
Material: type RE060-LF phenolic resin laminated paper FR 2, organic surface protection (OSP), type RE60-LF epoxy resin FR 4 hot-tinned (HAL lead-free).
Board thickness: 1.5 mm.
Termination: connectors DIN 41612 design C, 32-, 64- and 96-pole.
Hole matrix: 37 x 56 solder lands.
Diameter of solder lands: 2.1 mm.
Hole diameter: 1.0 mm.
Grid: 2.54 x 2.54 mm.
| Filter | Property | Value |
|---|---|---|
| Version | lab board | |
| One / two-sided | single sided | |
| Material | FR4 epoxy | |
| Throughplated | No | |
| Grid | 2.54 mm | |
| Length | 100 mm | |
| Width | 160 mm | |
| Height | 1.5 mm | |
| Hole diameter | 1 mm | |
| copper strength | 35 m | |
| Surface type | hot air leveling (HAL) |
| Property | Value |
|---|---|
| Country of origin | BG |
| Customs tariff number | 85340019 |
| Property | Value |
|---|---|
| SVHC free | Yes |
| Date of RoHS guidelines | 3/31/15 |
| RoHS conform | Yes |