RE334-LF | Roth Elektronik
Prototyping board, RE334-LF, 100 x 160 mm, epoxy resin
Prototyping boards, type Roth Elektronik RE334-LF.
Double-sided, 35 µm copper plating (through-plated); Format: 100 x 160 mm. Substrate: epoxy resin FR 4, hot-tinned (HAL lead-free). Grid: 2.54 x 2.54 mm. Hole matrix: 32 x 53 solder lands with diameter of 2.0 mm², option for installing connectors to DIN 41612 design C (32-, 64- and 96-pole). Hole diameter: 1.0 mm. Board thickness: 1.5 mm, component an solder side with solder resist coating and position labeling, component side with full copper plating.
Type: RE334-LF, 100 x 160 mm, epoxy resin
Version | lab board | |
Width | 160 mm | |
Throughplated | Yes | |
One / two-sided | double-sided | |
Height | 1.5 mm | |
copper strength | 35 m | |
Length | 100 mm | |
Hole diameter | 1 mm | |
Material | FR4 epoxy | |
Surface type | hot air leveling (HAL) | |
Grid | 2.54 mm |
Country of origin | AT |
Customs tariff number | 85340019 |
RoHS conform | Yes |
Date of RoHS guidelines | 3/31/15 |
SVHC free | Yes |