RE220-LF | Roth Elektronik
Lab board, 100 x 160 mm, pitch 2.54 mm, single sided, FR4 epoxy, Cu 35 µm, RE220-LF
No longer in assortment
Prototyping board, RE220-LF, Roth Elektronik
Single-or double-sided, 35 µm copper plating. With option for installing connectors to DIN 41617 (31-pole); Hole matrix: grid 2.5 x 2.5 or 2.54 x 2.54 mm, 37 x 58 solder lands. Diameter of solder lands: 2.2 mm. Hole diameter: 1.0 mm. Substrate: phenolic resin laminated paper FR 2, organic surface protection (OSP) or epoxy resin FR 4, hot-tinned (HAL lead-free). Board thickness: 1.5 mm.
Single-sided plating, 2.54 x 2.54 mm grid, type RE220-.
Technical attributes (type, Format, substrate): RE220-LF, 100 x 160 mm, epoxy resin.
| Filter | Property | Value |
|---|---|---|
| Version | lab board | |
| One / two-sided | single sided | |
| Material | FR4 epoxy | |
| Throughplated | No | |
| Grid | 2.54 mm | |
| Length | 100 mm | |
| Width | 160 mm | |
| Height | 1.5 mm | |
| Hole diameter | 1 mm | |
| copper strength | 35 m | |
| Surface type | hot air leveling (HAL) |
| Property | Value |
|---|---|
| Country of origin | BG |
| Customs tariff number | 85340019 |
| Property | Value |
|---|---|
| Date of RoHS guidelines | 3/31/15 |
| RoHS conform | Yes |
| SVHC free | Yes |