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Connectivity Module

Connectivity Module

Multi-chip modules (MCM) are active components that combine several chips in a single package to combine their different functions. On the outside, the multi-chips look like individual chips and are built in the same way. The microchips either lie next to each other and are connected to each other via the multi-chip board, or they are stacked on top of each other. In this case, the individual elements of the multi-chip module are linked by through silicon vias.

Multi-Chip-Modules are based on different technologies:

  • MCM-L: Printed circuit board technology (L stands for Laminated)
  • MCM-C: Thick film technology (C stands for Ceramic)
  • MCM-D: Thin film technology (D stands for Deposited)

Due to their compact design and high integration density, multi-chip modules are used in many areas, such as mobile devices, consumer electronics and telecommunications. They are also increasingly being used in the field of automation, since the sensor with interfaces, converters and microcontrollers, for example, they can be integrated into a multi-chip module.

Multi-Chip-Modules at Bürklin Elektronik

At Bürklin Elektronik you will find a wide range of multi-chips, including wireless modules and GNSS or GPS modules. We will be pleased to help you find the right component, whether in the area of active or passive components. You can reach us on weekdays from 8.00 a.m. to 7.00 p.m. on the service hotline +49 89 55875-230 or by e-mail at info@buerklin.com.

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