RE60-LF | Roth Elektronik
Lab board, 100 x 160 mm, pitch 2.54 mm, single sided, FR4 epoxy, Cu 35 µm, RE60-LF
Prototyping board, RE60-LF, Roth Elektronik
Single-sided 35 µm copper plating.
Dimensions: 100 x 160 mm.
Material: type RE060-LF phenolic resin laminated paper FR 2, organic surface protection (OSP), type RE60-LF epoxy resin FR 4 hot-tinned (HAL lead-free).
Board thickness: 1.5 mm.
Termination: connectors DIN 41612 design C, 32-, 64- and 96-pole.
Hole matrix: 37 x 56 solder lands.
Diameter of solder lands: 2.1 mm.
Hole diameter: 1.0 mm.
Grid: 2.54 x 2.54 mm.
Version | lab board | |
Width | 160 mm | |
Throughplated | No | |
One / two-sided | single sided | |
Height | 1.5 mm | |
copper strength | 35 m | |
Length | 100 mm | |
Hole diameter | 1 mm | |
Material | FR4 epoxy | |
Surface type | hot air leveling (HAL) | |
Grid | 2.54 mm |
Country of origin | BG |
Customs tariff number | 85340019 |
RoHS conform | Yes |
Date of RoHS guidelines | 3/31/15 |
SVHC free | Yes |