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Ceramic heat conducting foils for semiconductors, type Assmann C20.
For all standard applications; Features: silicon foil with high-grade glass fiber-reinforced ceramic filling, very low thermal transfer resistance, very flexible, non-combustible to UL 94 V-0, application of thermal transfer compound is not necessary. Material thickness: 0.2 mm. Color: dark red. Thermal transfer resistance: 0.30 to 0.35 °C. Tensile strength: 25.9 MPa. Tear resistance: 70 kN/m. Contact resistance: 1.8 x 10^12 ohm x m. Dielectric strength: 2.0 kV. Operating temperatures: –60 to +200 °C.
Standard version, type V86.
Technical attributes (type, for package size, dimensions): V8632, TO 126/SOT 32, 12 x 10 mm