Heat Sinks and Compounds

Thermal transfer compound, 7.0 g injector, CW7270

Thermal transfer compound WLP 500, silicone based, 500g can

Thermal transfer compound, 250 g can, V 6514D

Thermal transfer compound, 50 g tube, V 5350

Thermal transfer compound, 5.0 ml injector, WLPK 5

Thermal transfer compound, 16 W/mK, 2.7 g/cm³, –50 to +200 °C, in 3.5 g injector, 31103

Thermal transfer compound, 3.0 ml injector, WLPK 3

Zinc and silicone-free thermal paste

Thermal transfer compound, 1.0 g injector, 0.81 W/mK, P12

Copper heatsink, 8 x 26 x 10 mm, 29.3 K/W, solderable surface

Extruded heatsink, 1000 x 112 x 67.5 mm, 1.4 to 0.5 K/W, black anodized

Extruded heatsink, 1000 x 300 x 15 mm, 1.3 to 0.5 K/W, natural aluminum

Extruded heatsink, 1000 x 100 x 40 mm, 2.15 to 0.9 K/W, black anodized

Heatsink, 23 x 20 x 1 mm, 0.3 K/W

Finger shaped heatsink, 28 x 18.5 x 15 mm, 17 K/W, black anodized

Finger shaped heatsink, 38 x 26 x 22 mm, 9.9 K/W, black anodized

1829904-2

Extruded heatsink, 150 x 200 x 25 mm, 1.65 to 0.7 K/W, black anodized

Extruded heatsink, 150 x 300 x 83.5 mm, 0.4 to 0.21 K/W, natural aluminum

Extruded heatsink, 50 x 33 x 10 mm, 11.5 to 5.9 K/W, black anodized